FOR ENGINEERS, INTEGRATORS & COMPONENT TEAMS

Data center liquid cooling.
Every interface matters.

From the CDU to the cold plate, understand what belongs in your cooling-loop specification—and what evidence to request for the seals that enter it.

Start with the surface.

VeriClean Seals™ address documented seal-surface particulate cleanliness. Compatibility, system design, and commissioning remain separate engineering decisions.

Explore seal cleanliness testing
TYPICAL LIQUID-TO-LIQUID DIRECT-TO-CHIP ARCHITECTURE
  1. 01

    Facility side

    Building cooling and heat rejection

  2. 02

    CDU

    Heat exchange and coolant management

  3. 03

    Distribution

    Manifolds, hoses and quick disconnects

  4. 04

    Cold plates

    IT-side heat pickup at the chips

Simplified functional view, not a plumbing diagram. In a liquid-to-liquid CDU, facility water and the technology cooling fluid exchange heat across a heat exchanger; they are not one shared fluid stream. Actual architectures vary.

FIVE GUIDES. ONE ENGINEERING REVIEW.

Choose your starting point

Original engineering resources from Pacific Rubber & Packing

Application Brief01

Liquid Cooling Seal Cleanliness Testing

Plan liquid cooling seal cleanliness testing with VeriClean Seals™: define particulate scope, qualification records, packaging, and handling controls.

Read the guide
Material Qualification02

Seal Qualification and Coolant Compatibility

Qualify liquid-cooling seals with exact compound and coolant details, operating limits, aging evidence, and separate VeriClean Seals™ cleanliness checks.

Read the guide
Cooling Components03

CDU to Cold Plate: A Liquid Cooling Component Guide

Trace liquid cooling from facility water to cold plates, then evaluate pumps, manifolds, hoses, connectors and seal cleanliness with VeriClean Seals™.

Read the guide
Water & Contamination04

Facility Water vs. TCS: Cooling Contamination Explained

Understand facility water versus TCS contamination, coolant chemistry, flushing and equipment-specific filtration, plus the limits of clean seals.

Read the guide
Cooling Architectures05

Direct-to-Chip vs. Immersion Cooling for Data Centers

Compare data-center cold plates and immersion cooling, including heat rejection, fluid compatibility, service, costs, monitoring and seal cleanliness.

Read the guide

Extend your review

Component cleanliness belongs alongside filtration, controlled handling, and a project-specific commissioning plan—not in place of them.

Filtration and hydraulic tradeoffs →Seal handling and chain of custody →Writing a surface-cleanliness requirement →

Plan the commercial conversation

Cooling costs depend on system architecture and operating conditions. Use the existing calculators to explore your own assumptions; modeled results are not guaranteed savings from a seal.

Explore the risk calculator →Explore the sustainability calculator →Discuss your seal application →

Published November 5, 2026. These resources explain design and qualification considerations; they are not equipment certifications, full-loop service offers, or universal material-compatibility approvals. Independent engineering references appear in each guide.